Ron, Thanks for sharing that link.
The points of most interest to me in that white paper is that our methods of adding components to a board (especially where we cannot place the component onto a properly plated pad - i.e, a trace scraped cleared of solder masking) are at greater risk for vibration and aging failure when bonded with lead-free solder. 73, Don W3FPR > -----Original Message----- > > Mike S brought up an interesting issue about the strength of lead-free > solder joints referencing a paper by Borgesen of Universal Instruments > Corporation and Henderson of IBM Corporation: > > http://www.pcbrc.com/dev/PDFs/WhitePaper-SACfragility1.pdf > > I'm as 'green' as the next guy but I'll stick with my leaded solder. After > all, I'm not planning to dump any of my Elecraft rigs in the land fill > anytime soon... > > Ron AC7AC > > -- No virus found in this outgoing message. Checked by AVG Free Edition. Version: 7.5.432 / Virus Database: 268.15.26/594 - Release Date: 12/20/2006 3:54 PM _______________________________________________ Elecraft mailing list Post to: [email protected] You must be a subscriber to post to the list. Subscriber Info (Addr. Change, sub, unsub etc.): http://mailman.qth.net/mailman/listinfo/elecraft Help: http://mailman.qth.net/subscribers.htm Elecraft web page: http://www.elecraft.com
