The practice of die shrinking & speedups causes problems in the digital IC
arena also.  The old but once heavily used 8051 processor is an example.
Original designs were with the NMOS (HMOS?) version but later began being
replaced by faster CMOS versions.  We could see some of that clearly in
certain product audits.

Jack Cook,
Xerox EMC Engineering

-----Original Message-----
From: Dan Kwok [mailto:[email protected]]
Sent: Thursday, October 25, 2001 1:16 PM
To: Jim Eichner; 'EMC-PSTC - forum'
Subject: Re: Shrunk-die power MOSFET's and compliance



Jim,

You have my sympathies. Some manufacturers don't seem to realize that their
so called product "improvements" may actually cause undue grief and
hardships
on their customers. "Specifications subject to change without notice" is a
common catch clause associated with far many products on the market these
days.

In one company where I worked many years ago, we had an incoming inspection
department that routinely carried out random samplings and measured critical
parameters for crystals and semiconductors. With this approach, most
out-of-spec devices simply did not make it to the store bins.

On the brighter side, speeding up a FET is hard to do. Slowing it down in a
circuit is much easier for EMC purposes.

---------------------------------------------------------------------
Dan Kwok,  P.Eng.
Principal Engineer
Electromagnetic Compatibility
Intetron Consulting,  Inc.
Ph  (604) 432-9874
E-mail [email protected]
Internet  http://www.intetron.com




----- Original Message -----
From: "Jim Eichner" <[email protected]>
To: <[email protected]>; "Jim Eichner" <[email protected]>;
"'EMC-PSTC - forum'" <[email protected]>
Sent: Wednesday, October 24, 2001 11:54 AM
Subject: RE: Shrunk-die power MOSFET's and compliance


>
> Well for example, I have just finished specifying what compliance
re-testing
> I am going to need to do on 4 different products whose power conversion
> stages use IRF630's, IRF740's, IRF840's, and RFP50N06's, but the list goes
> on and on.  If you are using power FET's in power electronics, chances are
> they have changed or will soon.  The main manufacturers that come to mind
> are IR, Fairchild/Harris, Philips, and STM-Thomson.  Not all have forced
> changes to the shrunk-die version - some have agreed to keep the old style
> available - and all have at least added a suffix to their markings on the
> devices so you can tell if it's the new revision die or old.  In one case,
> however, we received modified parts with no markings differentiating them
> from the old rev parts, for almost a year with no communication from the
mfr
> telling us about the change.  We found out through other channels and then
> contacted them.  They seem to be behaving as if fundamental changes to the
> performance and specifications of the part are none of our business.
>
> I am re-doing radiated and conducted emissions, some thermal testing, and
a
> bunch of functional testing and looking at waveforms on 4 different
products
> affected by this change.  Those are only the products I am responsible
for -
> as a company we're doing functional testing and possibly compliance
> re-testing on many more products.
>
> This is not a simple component substitution exercise, if your products are
> or use power electronics!  I would advise everyone potentially affected to
> have your procurement department look into this.
>
> Regards,
> Jim Eichner, P.Eng.
> Manager, Engineering Services
> Xantrex Technology Inc.
> Mobile Power
> web: www.xantrex.com <http://www.xantrex.com>
> Any opinions expressed are those of my invisible friend, who really
> exists. Honest.
>
>
>



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