No takers?  I haven't had any responses, but I can't believe that ins't an
issue for many of you.  The switch-mode power supplies used in almost all
equipment these days are the main users of these FET's, and the FET design
change does effect compliance.

Have none of you run into this issue? 


Jim Eichner, P.Eng.
Manager, Engineering Services
Xantrex Technology Inc.
Mobile Power
phone:  (604) 422-2546
fax:      (604) 420-1591
e-mail:  [email protected]
web:     www.xantrex.com 


-----Original Message-----
From: Jim Eichner [mailto:[email protected]]
Sent: Wednesday, October 17, 2001 5:11 PM
To: 'EMC-PSTC - forum'
Subject: Shrunk-die power MOSFET's and compliance



I'm curious what others in the compliance community have experienced over
the last year or so in regards to re-designed power MOSFET's that the big
FET manufacturers are pushing on us.  These next generation "trench" style
FET's have smaller dies, resulting in lower on-resistance but higher thermal
impedance to their cases, and in lower gate capacitances and faster rise
times.  

At first glance it seems obvious these changes could impact the compliance
of power conversion products in the areas of emissions (increase due to
faster rise times), susceptibility to surges, and perhaps temperatures (not
that agencies care about FET temperatures, but if they're hotter
neighbouring components may be too).

The FET's involved are some of the highest volume parts these mfr's make (to
achieve maximum savings), and are widely used in power electronics.  Since
most products either are, use, or contain power electronics these days, I'd
expect this issue to be affecting almost all of us.

I'd be glad to hear of any experiences the forum has had with this issue.

Thanks,
Jim Eichner, P.Eng. 
Manager, Engineering Services 
Xantrex Technology Inc. 
Mobile Power
web: www.xantrex.com
Any opinions expressed are those of my invisible friend, who really exists.
Honest.


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