I'm curious what others in the compliance community have experienced over the last year or so in regards to re-designed power MOSFET's that the big FET manufacturers are pushing on us. These next generation "trench" style FET's have smaller dies, resulting in lower on-resistance but higher thermal impedance to their cases, and in lower gate capacitances and faster rise times.
At first glance it seems obvious these changes could impact the compliance of power conversion products in the areas of emissions (increase due to faster rise times), susceptibility to surges, and perhaps temperatures (not that agencies care about FET temperatures, but if they're hotter neighbouring components may be too). The FET's involved are some of the highest volume parts these mfr's make (to achieve maximum savings), and are widely used in power electronics. Since most products either are, use, or contain power electronics these days, I'd expect this issue to be affecting almost all of us. I'd be glad to hear of any experiences the forum has had with this issue. Thanks, Jim Eichner, P.Eng. Manager, Engineering Services Xantrex Technology Inc. Mobile Power web: www.xantrex.com Any opinions expressed are those of my invisible friend, who really exists. Honest. ------------------------------------------- This message is from the IEEE EMC Society Product Safety Technical Committee emc-pstc discussion list. Visit our web site at: http://www.ewh.ieee.org/soc/emcs/pstc/ To cancel your subscription, send mail to: [email protected] with the single line: unsubscribe emc-pstc For help, send mail to the list administrators: Michael Garretson: [email protected] Dave Heald [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] All emc-pstc postings are archived and searchable on the web at: No longer online until our new server is brought online and the old messages are imported into the new server.
