On 5/25/2005, John Barnes wrote:
Do you HAVE to have the groundplane in the area that requires the hi-pot test? Hi Chris: I agree with John that it is best to avoid having your ground and high voltage circuits overlap. The basic approach that John described is typically used in modems and power supplies. If you *must* overlap them, see if you can come up with a scheme that keeps the core of the board within the barrier. Failing that, if you leave at least one layer unused in the barrier you will double up on the number of prepreg layers in your barrier. I have used all three techniques over the years, but the one I prefer is to keep from overlapping the circuits at all. Joe Randolph Telecom Design Consultant Randolph Telecom, Inc. 781-721-2848 (USA) [email protected] http://www.randolph-telecom.com <http://www.randolph-telecom.com/> ---------------------------------------------------------------- This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. Website: http://www.ieee-pses.org/ To post a message to the list, send your e-mail to [email protected] Instructions: http://listserv.ieee.org/listserv/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas [email protected] Mike Cantwell [email protected] For policy questions, send mail to: Richard Nute: [email protected] Jim Bacher: [email protected] All emc-pstc postings are archived and searchable on the web at: http://www.ieeecommunities.org/emc-pstc
