Chris,
Do you HAVE to have the groundplane in the area that requires the hi-pot
test? I've designed several 6-layer cards that had a small MODEM area
with protective components for tip and ring. We just placed the RJ-11
jack close to a grounded mounting point for the card, which served as
the protective ground for the MODEM. We ran the tip, ring, and
phone-ground traces on just the top and bottom layers, giving us the
full thickness of the card for insulation. We created a keep-out
area--in all the layers--that extended 5mm outside the traces and pads,
giving us reinforced insulation to everything else on the card. The
only holes we permitted in this keep-out area were:
* Plated-through holes for pin-through-hole (PTH) components.
* 8 via holes around the mounting point, to ensure that the top and
bottom pads were tied together even if we had imperfect plating in
the mounting hole itself.
John Barnes KS4GL, PE, NCE, ESDC Eng, PSE, SM IEEE
dBi Corporation
http://www.dbicorporation.com/
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