Hello Sylvia,
My general advice is to concentrate on any tests where the existing design passed the specified requirements with minimal margin. It is unlikely that alternate memory chips would require new safety testing. I can conceive of circumstances where you would have a product that marginally passed a heating test and the new memory ICs consumed more power, but this is a long shot. You would need to have a lot of these ICs in the design before they could contribute significantly to power consumption and dissipation. If you have only a few of these ICs, it is unlikely that safety would be an issue. You may consider running a new radiated emissions test, but the need may depend on numerous factors. If the new memory ICs have significantly smaller feature sizes, the edge rates could be noticeably faster leading to higher emissions. However, the new testing may not uncover issues unless the original device was close to the limit due to noise from the memory ICs. It is unlikely that new memory chips would generate enough noise below 30 MHz that would couple through a power supply, thereby requiring new conducted emissions testing. It can be harder to determine if the new memory chips will affect immunity test results. The new ICs may have a more sensitive reset line for example. Your existing design may tolerate some noise on reset, while the new memory chips would not. This could be a problem during ESD or possibly EFT. My personal experience has been that many of the other immunity tests are less likely to be affected by alternate memory chips. If your software plays any role in the product’s safety, I would have a different recommendation. In that case, I recommend that you run the complete set of immunity tests. You don’t want the risk of different memory behavior affecting the system adversely. In this case, you may need to consider a new round of all tests, not just immunity. Regards, Ted Eckert Compliance Engineer Microsoft Corporation [email protected] The opinions expressed are my own and do not necessarily reflect those of my employer. From: Sylvia Toma [mailto:[email protected]] Sent: Wednesday, June 10, 2009 11:41 AM To: [email protected] Subject: end-product testing Dear experts, Could you shed some light as to what type of tests or checking one might do in an end product when qualifying alternate memory chips (SDRAM, DRAM, etc.)? Memory vendors generally do their own functional testing before product is shipped. Functional tests usually include VCC speed verification, VCC margin, VCC bump, Dynamic and static research and a full range of array exercising algorithms. As much as this is being done, we still see occasional failures in end-product due to manufacturing defect of the chip or process breakdown at the chip manufacturing location. I'm looking forward to your guidance. Regards Sylvia - This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. To post a message to the list, send your e-mail to <[email protected]> All emc-pstc postings are archived and searchable on the web at http://www.ieeecommunities.org/emc-pstc Graphics (in well-used formats), large files, etc. can be posted to that URL. Website: http://www.ieee-pses.org/ Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas <[email protected]> Mike Cantwell <[email protected]> For policy questions, send mail to: Jim Bacher <[email protected]> David Heald <[email protected]> - This message is from the IEEE Product Safety Engineering Society emc-pstc discussion list. To post a message to the list, send your e-mail to <[email protected]> All emc-pstc postings are archived and searchable on the web at http://www.ieeecommunities.org/emc-pstc Graphics (in well-used formats), large files, etc. can be posted to that URL. Website: http://www.ieee-pses.org/ Instructions: http://listserv.ieee.org/request/user-guide.html List rules: http://www.ieee-pses.org/listrules.html For help, send mail to the list administrators: Scott Douglas <[email protected]> Mike Cantwell <[email protected]> For policy questions, send mail to: Jim Bacher <[email protected]> David Heald <[email protected]>
