In message <[email protected]>, dated Tue, 13 May 2014, "ce-test, qualified testing bv - Gert Gremmen" <[email protected]> writes:

The theory assumes that most damage is done by small local discharges caused by a discontinuous conductive path (imagine condensation drops or small wet particles)
called scintillations.

This is not really an assumption; it's one of at least two mechanisms that are known to occur. Another is the electrolytic decomposition of conducting salts (no necessarily NaCl) on the surface. This can liberate gases in an activated form that attacks the insulating material.

These are micro sparks (visible with the right equipment) that create local temperatures well above 1000 degrees,

Because they are sparks, the peak voltage is relevant, at least initially.

and contribute to a local burning disintegration of the (carbon containing) base material in areas of about 0.2 mm. Once enough areas have been affected a full continuous (carbon) leakage path is created on the surface that may lead to further damage. This is a more or less statistical process.

The size and frequency of these scintillations and affected areas seem dependent of the voltage and total damage is therefore a time integration of voltage over the creepage path.

Not really. The carbon track resistance progressively reduces as more degradation occurs. This is probably a mixture of thermal and electrochemical degradation, thermal dominating when/if the current becomes high enough. The time-integral of the current is relevant but because the resistance decreases with time, that is not proportional to the integrated voltage.

In my opinion this leads to the conclusion that an average voltage value should be choosen, Instead of rms, to determine creepage path, but I may overlook certain aspects. Correct me where I am wrong.

I think there is avoidable risk if one ignores peak voltage.

Stimper states that leakage currents due to fully continuous conductive paths
can be neglected,

That's a VERY bold statement. There is a third mechanism that can catch one out if unlucky. This is electromigration of metallic film across insulation, and it can occur at quite low voltages. Silver is particularly prone to electromigration, as I found long ago when trying to explain why some reverse-biased Ge 'power' diodes failed short-circuit. Attacking the glass insulator with metal polish restored diode operation!

and only in the last phase of drying, sufficient discontinuities exist for scintillation. Alternating humidity conditions such as day/night rhythms, in relatively cold (need for condensation droplets) designs are most liable to creepage problems

Those effects occur but they are not all of the story.
--
OOO - Own Opinions Only. With best wishes. See www.jmwa.demon.co.uk
Nondum ex silvis sumus
John Woodgate, J M Woodgate and Associates, Rayleigh, Essex UK

-
----------------------------------------------------------------
This message is from the IEEE Product Safety Engineering Society emc-pstc discussion 
list. To post a message to the list, send your e-mail to <[email protected]>

All emc-pstc postings are archived and searchable on the web at:
http://www.ieee-pses.org/emc-pstc.html

Attachments are not permitted but the IEEE PSES Online Communities site at 
http://product-compliance.oc.ieee.org/ can be used for graphics (in well-used 
formats), large files, etc.

Website:  http://www.ieee-pses.org/
Instructions:  http://www.ieee-pses.org/list.html (including how to unsubscribe)
List rules: http://www.ieee-pses.org/listrules.html

For help, send mail to the list administrators:
Scott Douglas <[email protected]>
Mike Cantwell <[email protected]>

For policy questions, send mail to:
Jim Bacher:  <[email protected]>
David Heald: <[email protected]>

Reply via email to