<snip>
> Now i've noticed
> that the connections from the vias to the pour on the signal layer are
> directly connected, that is to say, no thermal relief pattern. Anyone
know
> how to change this? alternatively, does anyone have another suggested way
> to do this? (i.e. maybe inverting the gerber in camtastic somehow?) or is
> it really a big deal? forgive my naivete, but i'm not exactly sure what
> the purpose of the thermal relief is (keeping the power plane from getting
> too hot ?) and if i could stand to live without them in this case.
>
> -rimas
Use Design Rules to connect vias to polygons with a thermal relief pattern.
(But read on.)
The idea of connecting pads to polygons or Power Plane layers with thermal
relief patterns is to make it easier to solder components' leads to such
pads. When a direct connection is used instead, the surrounding copper can
act as a heatsink, and so make it more difficult to solder the lead to the
pad concerned. OTOH, a thermal relief pattern leaves the pad connected
electrically, but isolates the pad, thermally, to some extent. (In reality,
there is a balancing act between the quality of the electrical connection
and how much thermal isolation has been achieved. As such, thermal relief
pattern settings *should* be set to achieve the "best"/"optimal" outcome in
this regard.)
Unless there is some reason for doing otherwise, I would suggest that vias
should be direct connected to both polygons and Power Plane layers, as there
is no reason for these to be soldered. Does anyone have a dissenting
viewpoint on this one?
Regards,
Geoff Harland.
-----------------------------
E-Mail Disclaimer
The Information in this e-mail is confidential and may be legally
privileged. It is intended solely for the addressee. Access to this
e-mail by anyone else is unauthorised. If you are not the intended
recipient, any disclosure, copying, distribution or any action taken
or omitted to be taken in reliance on it, is prohibited and may be
unlawful. Any opinions or advice contained in this e-mail are
confidential and not for public display.
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* To post a message: mailto:[EMAIL PROTECTED]
*
* To leave this list visit:
* http://www.techservinc.com/protelusers/subscrib.html
* - or email -
* mailto:[EMAIL PROTECTED]?body=leave%20proteledaforum
*
* Contact the list manager:
* mailto:[EMAIL PROTECTED]
*
* Browse or Search previous postings:
* http://www.mail-archive.com/[email protected]
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
