Folks,
I'm new to the group...so I apologise if this area has been covered
previously. Let me know if it's worth searching the archives on
this topic.
Can anyone shed any light on whether Protel can handle buried/blind
and microvia technologies?
If so, are there any "nasties" to look out for? or setups that may not
be obvious?
We have a design that will require blind vias from both top and bottom
sides, as well as buried vias between multiple internal layers.
Any advice would be greatly appreciated.
Regards,
Jason.
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