Keith,
possibly I am just the first of many to ask but can you elaborate a
little more on this method you used. I can't see how you could get a
conductive connection through the prepreg layering to connect the layers you
seem to be indicating were connected.
My suspicion is that this was accomplished through expensive
controlled depth drilling? If you don't know, could you ask your fabricator
how they accomplished this? Some how that prepreg had to be drilled (post
lamination) and plated across to make the connection between odd layers.
Brad Velander,
Lead PCB Designer,
Norsat International Inc.,
#300 - 4401 Still Creek Dr.,
Burnaby, B.C., V5C 6G9.
Tel. (604) 292-9089 direct
Fax (604) 292-9010
website www.norsat.com
> -----Original Message-----
> From: Keith Ashcraft [mailto:[EMAIL PROTECTED]]
> Sent: Friday, June 15, 2001 5:46 AM
> To: Protel EDA Forum
> Subject: Re: [PEDA] Build-up technologies in Protel
>
> Hey ALL,
>
<SNIP>
> A problem I had was I needed blind vias that were between
> 2-different layers
> that were not adjacent to each other, so here is what I did.
> I stacked blind
> vias on top of each other, and that seemed to work out OK and
> the board house
> had no problem with this. Make sure that your drill file
> reflects this type of
> method. I jumped between 5-layers using this method, and
> everything seemed to
> work fine. I did use P98SP3 for autorouting, and get me in
> the ball park, then I
> cleaned up the little things until it DRC'd clean.
>
> So, I can't tell you any more about "nasties", but it is do-able!!
>
> Keith
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