Hi Jason
Sometimes there can be a slow response to postings, and also I've had the
occasional non-response.
I myself haven't had any experience with buried/blind/micro vias (as much as
I really want to) however I assume the following two places to set things up
may lead you in the right direction:
Design > Layer Stack Manager > Layer Pairs (drop-down).
Design > Layer Stack Manager > Drill Pairs (button on bottom right open
another dialogue box).
Also, when you go to the printer setup, when you InsertPrintLayer, the
dialogue box there has a tab for DrillOptions.
All I can suggest is to contact your preferred manufacturer and begin
discussions with them as to what they expect to see, and document the hell
out of the design when you send it to the manufacturer so there is no doubt
as to what you want incl layer stackup etc.
Hope this is of some use.
Regards
Brendon
----- Original Message -----
From: "Jason Stummer" <[EMAIL PROTECTED]>
To: "Protel" <[EMAIL PROTECTED]>
Sent: Friday, June 15, 2001 11:36 AM
Subject: [PEDA] Build-up technologies in Protel
> Folks,
>
> I'm new to the group...so I apologise if this area has been covered
> previously. Let me know if it's worth searching the archives on
> this topic.
>
> Can anyone shed any light on whether Protel can handle buried/blind
> and microvia technologies?
>
> If so, are there any "nasties" to look out for? or setups that may not
> be obvious?
>
> We have a design that will require blind vias from both top and bottom
> sides, as well as buried vias between multiple internal layers.
>
> Any advice would be greatly appreciated.
>
> Regards,
>
> Jason.
>
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