> I'm new to the group...so I apologise if this area has been covered
> previously. Let me know if it's worth searching the archives on
> this topic.
>
> Can anyone shed any light on whether Protel can handle buried/blind
> and microvia technologies?
>
> If so, are there any "nasties" to look out for? or setups that may not
> be obvious?
>
> We have a design that will require blind vias from both top and bottom
> sides, as well as buried vias between multiple internal layers.
>
> Any advice would be greatly appreciated.
>
> Jason.
Protel's vias can be either through-hole in nature (Top outside copper layer
through to Bottom outside copper layer), or "blind" (an outside copper layer
to an internal copper layer) or "buried" (between any two internal copper
layers); each via has a "LowLayer" and "HighLayer" property, which specify
the "uppermost" and "lowermost" layers.
I am not sure, off-hand, if there is a lower limit on the copper diameter
and hole diameter for a via, so I cannot comment on whether Protel supports
microvia technology per se. But I have an idea that it probably does.
Fairly early on in the design of a PCB, you should use the Layer Stack
Manager to establish internal copper layers; it is possible to stipulate
whether each of these is a Power Plane layer or a "standard"/"signal" layer,
and the sequence and overall number of these. Up to 16 Power Plane layers
can be used, and/or up to 30 internal "signal" layers (which means that the
maximum number of copper layers supported by Protel is 48, when also
counting the two external copper layers, which are always assumed to be
present).
The Drill Pair Manager should also be used to specify/control which *pairs*
of copper layers can be connected by the holes within vias. (The
"through-hole" Layer Pair of Top copper layer to Bottom copper layer is
fundamental, and as such, can not be deleted or otherwise edited.)
Regards,
Geoff Harland.
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