Peter Clifton wrote: > Whilst we're extending support for layer types, blind and buried vias, > we ought to consider the increasing popularity of embedded passives. > > > For example, there are processes which build embedded resistors (and > possibly capacitors, perhaps even inductors) using special layers which > build up or etch away a resistive portion of the board stack-up. > > We should aim to understand the needs of that kind of process, and allow > the possibility that our new revised layer system can support it.
Yes, I have used pcb to create resistors by conductive inks and the pad stack idea is one thing that will help it. Another is a footprint that can have a via, since there is a need for a conductor connection point to the resistive material, and it sometimes needs a covering layer of insulating material that gives it long life and always needs a covering layer of insulating material that allows crossovers. Besides inks, organic semiconductor material needs both under and over prints of insulator almost always, so that means buried vias also. John Griessen PS I'll be glad to wikify anything I've suggested and some of the others who claim inability to wikify. PPS The wikifying is easy... go ahead and create a login and do it instead of acting lazy. -- Ecosensory Austin TX _______________________________________________ geda-dev mailing list geda-dev@moria.seul.org http://www.seul.org/cgi-bin/mailman/listinfo/geda-dev
