Hi, I just noticed that punching a via into a large ground pad does not produce a non-copper (clearance) ring around the via, as it would do for vias inside polygons, see screenshot:
http://user.cs.tu-berlin.de/~dvdkhlng/via-in-pad.png I guess such kind of via wouldn't be manufacturable since it isn't thermally shielded from the surrounding pad? Or is it just a bad idea to connect die-attach-pads directly with vias? David -- GnuPG public key: http://user.cs.tu-berlin.de/~dvdkhlng/dk.gpg Fingerprint: B17A DC95 D293 657B 4205 D016 7DEF 5323 C174 7D40 _______________________________________________ geda-user mailing list [email protected] http://www.seul.org/cgi-bin/mailman/listinfo/geda-user
