todd.black...@gmail.com wrote: > Would it be useful to have a keepout layer? Also microvias and buried/blind > vias could show which layers are actually pierced.
would this be a category for all keepouts (copper, component, etc) or are there individual ones? Actually, I'd suggest we either keep these lumped into the "other" or just a single catch all "keepout". Mostly my motivation is to group things into those which affect the board manufacturing process and those which do not. -Dan ------------------------------------------------------------------------------ Let Crystal Reports handle the reporting - Free Crystal Reports 2008 30-Day trial. Simplify your report design, integration and deployment - and focus on what you do best, core application coding. Discover what's new with Crystal Reports now. http://p.sf.net/sfu/bobj-july _______________________________________________ Gerbv-devel mailing list Gerbv-devel@lists.sourceforge.net https://lists.sourceforge.net/lists/listinfo/gerbv-devel
