There are keepouts for components, for traces, and possibly for vias.
This would be used as a way to do DRC on the gerbers.  It would be for design 
checking as opposed to fab though.

todd
  

------Original Message------
From: Dan McMahill
To: Gerbv developers list
ReplyTo: Gerbv developers list
Subject: Re: [Gerbv-devel] probe connectivity?
Sent: Aug 12, 2009 6:40 PM

todd.black...@gmail.com wrote:
> Would it be useful to have a keepout layer?  Also microvias and buried/blind 
> vias could show which layers are actually pierced.

would this be a category for all keepouts (copper, component, etc) or 
are there individual ones?  Actually, I'd suggest we either keep these 
lumped into the "other" or just a single catch all "keepout".  Mostly my 
motivation is to group things into those which affect the board 
manufacturing process and those which do not.

-Dan

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