Our current algorithm will produce thermal connections between two pads (with 
no connections to the zone):



I assume no one will lose any sleep over dropping those?

Cheers,
Jeff.


> On 21 Jun 2019, at 19:49, Jean-Paul Louis <[email protected]> wrote:
> 
> Wayne,
> 
> Except in very hugh frequency design (higher UHF spectrum, microwaves and 
> millimeter waves)
> were chamfers can create more problems than they solve.
> 
> This chamfer should be user optional, the best being individual part layout 
> optional.
> 
> Just my extra data point,
> 
> Jean-Paul
> N1JPL
> 
> 
>> On Jun 21, 2019, at 8:05 AM, Wayne Stambaugh <[email protected]> wrote:
>> 
>> Jeff,
>> 
>> Users are going to expect chamfering if there is an option for it.  I
>> don't see how you are going to avoid adding chamfering to the spokes
>> unless we decide to do away with chamfering as an option.  I don't think
>> that's good idea because right angles on board geometry is generally
>> frowned upon.
>> 
>> Wayne
>> 
>> On 6/20/19 4:24 PM, Jeff Young wrote:
>>> Turns out there’s a slightly unintended side effect.
>>> 
>>> Before:
>>> 
>>> Note the two truncated thermal spokes to the surface-mount pads at the
>>> lower right.
>>> 
>>> After:
>>> 
>>> 
>>> 
>>> 
>>> The bug is fixed, but not that the junctions between the spokes and the
>>> zone body are no longer chamfered.
>>> 
>>> I’d say the “after” is better in that respect too, but again it’s
>>> definitely different.
>>> 
>>> Thoughts?
>>> 
>>> Cheers,
>>> Jeff.
>>> 
>>> 
>>>> On 20 Jun 2019, at 19:50, Reece Pollack <[email protected]
>>>> <mailto:[email protected]>> wrote:
>>>> 
>>>> Memory is the second thing to go as one ages.
>>>> 
>>>> I can't remember what the first one is.
>>>> 
>>>> ------------------------------------------------------------------------
>>>> *From: *"Jeff Young" <[email protected] <mailto:[email protected]>>
>>>> *To: *"jp charras" <[email protected] <mailto:[email protected]>>
>>>> *Cc: *"KiCad Developers" <[email protected]
>>>> <mailto:[email protected]>>
>>>> *Sent: *Thursday, June 20, 2019 2:46:58 PM
>>>> *Subject: *Re: [Kicad-developers] 6.0 Zone filling differences
>>>> 
>>>> Wow.  That’s sobering.  I wrote the board outline clearance changes….
>>>> 
>>>> Age sucks.
>>>> 
>>>> 
>>>>   On 20 Jun 2019, at 19:04, jp charras <[email protected]
>>>>   <mailto:[email protected]>> wrote:
>>>> 
>>>>   Le 20/06/2019 à 19:24, Jeff Young a écrit :
>>>> 
>>>>       I believe we now have a warning, but I can’t remember what
>>>>       change it was for.  I thought it was for the outline changes,
>>>>       but from what I can find on the mailing list archive it looks
>>>>       like we were satisfied that one wouldn’t change anything.
>>>> 
>>>>       So remind me what the warning is for?
>>>> 
>>>> 
>>>>   AFAIK, it is for board outline clearance change (taking in accounf or
>>>>   not the edge cut graphic items thickness, if I correctly remember).
>>>>   Zone outline changes (only activated if the kicad_advanced
>>>>   "ForceThickZones=0" option enables it), do not need any warning.
>>>> 
>>>> 
>>>>       The reason behind this request is that I have a new fill
>>>>       algorithm which fixes a long-standing bug regarding one pad’s
>>>>       thermal ring knocking out another pad’s thermal spoke.  It
>>>>       also allows thermal spokes on custom pad shapes (and would
>>>>       allow us to support custom number of spokes if we wished).
>>>> 
>>>>       While this should only change zone fills which would have been
>>>>       considered errors in the past, it nevertheless changes them.
>>>>        What’s the prescription for that?
>>>> 
>>>>       Cheers,
>>>>       Jeff.
>>>> 
>>>> 
>>>> 
>>>> 
>>>>   -- 
>>>>   Jean-Pierre CHARRAS
>>>> 
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