Today, there are many surface mount parts (MOSFETS, driver-chips etc.) that depend on a solid copper connection to aid in dissipating heat. Those pins should not have a thermal created to a ground plane. What is the best way to prevent the generation of this thermal?
( I think this should be an attribute of a pin type in eeschema - but it isn't there .. there might have been a 'T' attribute in PADS - might have been in the pad-stack definition? - if memory serves me right. I think it could default to T unless told not to do so). I think I can create a zone with thermals turned off - and kludge it up to work. This wasn't much of an issue in the past, but is rather common with the SM boards of today - probably should have some way to do this.. I want to write this up.. -------------------------------------------------------------------------------- Karl Schmidt EMail [email protected] Transtronics, Inc. WEB http://xtronics.com 3209 West 9th Street Ph (785) 841-3089 Lawrence, KS 66049 FAX (785) 841-0434 Action speaks louder than words but not nearly as often. -- Mark Twain --------------------------------------------------------------------------------
