Shouldn't there be more vias to take the heat to the bottom?

 

T
 
> To: [email protected]
> From: [email protected]
> Date: Mon, 17 May 2010 09:57:50 +0100
> Subject: Re: [kicad-users] Preventing thermals on special pads of SM packages
> 
> I often have to work with MLF/QFN devices, which have a thermal pad on 
> the bottom. There are two considerations here. Firstly there is the 
> heatsinking requirement, and secondly if you get the copper design wrong 
> the chip will float on a central blob of solder, resulting in unreliable 
> soldering of the pins.
> 
> For the thermal pad footprint for a 32 pin device I arrange 8 square 
> pads around a central via, and I place solder resist over the via. I 
> number all the (thermal) pads as "33", so I only end up with one extra 
> pin in eeschema. I connect together the pads and the via with a grid 
> of thick tracks. The use of a tented via in this way means that the 
> via will be solidly connected to the heatsinking copper zone on the 
> reverse side, whilst the tenting prevents solder wicking through the 
> via. This arrangement has worked well for me.
> 
> An alternative arrangement might be to use nine untented vias with very 
> small drill holes in the same pattern. This would give better thermal 
> contact between board and component, but I don't know how small the 
> holes would have to be to prevent solder wicking, or whether they would 
> end up so small that their heat transfer capability would be 
> compromised. If that were the case I guess you could use more vias 
> with a smaller annulus. However, whilst I would be interested to know 
> if this is a better method, I've no idea what size the holes would have 
> to be, I don't have the means to do the necessary experimentation, and 
> the arrangement I use currently works well enough for me.
> 
> Regards,
> 
> Robert.
> 
> On 15/05/2010 22:30, Karl Schmidt wrote:
> > Today, there are many surface mount parts (MOSFETS, driver-chips etc.) that 
> > depend on a solid copper
> > connection to aid in dissipating heat. Those pins should not have a thermal 
> > created to a ground
> > plane. What is the best way to prevent the generation of this thermal?
> >
> > ( I think this should be an attribute of a pin type in eeschema - but it 
> > isn't there .. there might
> > have been a 'T' attribute in PADS - might have been in the pad-stack 
> > definition? - if memory serves
> > me right. I think it could default to T unless told not to do so).
> >
> >
> > I think I can create a zone with thermals turned off - and kludge it up to 
> > work.
> >
> > This wasn't much of an issue in the past, but is rather common with the SM 
> > boards of today -
> > probably should have some way to do this..
> >
> > I want to write this up..
> >
> > --------------------------------------------------------------------------------
> > Karl Schmidt EMail [email protected]
> > Transtronics, Inc. WEB http://xtronics.com
> > 3209 West 9th Street Ph (785) 841-3089
> > Lawrence, KS 66049 FAX (785) 841-0434
> >
> > Action speaks louder than words but not nearly as often. -- Mark Twain
> >
> > --------------------------------------------------------------------------------
> >
> >
> > ------------------------------------
> >
> > Please read the Kicad FAQ in the group files section before posting your 
> > question.
> > Please post your bug reports here. They will be picked up by the creator of 
> > Kicad.
> > Please visit http://www.kicadlib.org for details of how to contribute your 
> > symbols/modules to the kicad library.
> > For building Kicad from source and other development questions visit the 
> > kicad-devel group at http://groups.yahoo.com/group/kicad-develYahoo! Groups 
> > Links
> >
> >
> >
> >
> >
> >
> > No virus found in this incoming message.
> > Checked by AVG - www.avg.com
> > Version: 9.0.819 / Virus Database: 271.1.1/2878 - Release Date: 05/16/10 
> > 19:26:00
> >
> 
> ------------------------------------
> 
> Please read the Kicad FAQ in the group files section before posting your 
> question.
> Please post your bug reports here. They will be picked up by the creator of 
> Kicad.
> Please visit http://www.kicadlib.org for details of how to contribute your 
> symbols/modules to the kicad library.
> For building Kicad from source and other development questions visit the 
> kicad-devel group at http://groups.yahoo.com/group/kicad-develYahoo! Groups 
> Links
> 
> 
> 
                                          

Reply via email to