Hi Sergei,
On 2018-10-10 13:47:36 +0300, Sergei Shtylyov wrote:
> On 10/10/2018 11:36 AM, Simon Horman wrote:
>
> >> Describe THS/CIVM in the R8A77980 device trees.
> >>
> >> Signed-off-by: Sergei Shtylyov <sergei.shtyl...@cogentembedded.com>
> >>
> >> ---
> >> This patch is against the 'renesas-devel-20181008-v4.19-rc7' tag of Simon
> >> Horman's 'renesas.git' repo.
> >>
> >> The thermal driver/bindings patches have been just posted...
> >>
> >> arch/arm64/boot/dts/renesas/r8a77980.dtsi | 38
> >> ++++++++++++++++++++++++++++++
> >
> > Thanks Sergei, one minor nit from me below.
> >
> > Niklas, I'd value your review of this patch.
> >
> >> 1 file changed, 38 insertions(+)
> >>
> >> Index: renesas/arch/arm64/boot/dts/renesas/r8a77980.dtsi
> >> ===================================================================
> >> --- renesas.orig/arch/arm64/boot/dts/renesas/r8a77980.dtsi
> >> +++ renesas/arch/arm64/boot/dts/renesas/r8a77980.dtsi
> >> @@ -330,6 +330,19 @@
> >> #power-domain-cells = <1>;
> >> };
> >>
> >> + thermal: thermal@e6198000 {
> >
> > "tsc:" would be consistent with other R-Car Gen 3 dtsi that
> > describe this device.
>
> There's no consistency even among those: R8A779{5|6}0 use "tsc:",
> R8A77995 uses "thermal:"... :-)
D3 (R8A77995) uses the Gen2 thermal driver while V3H uses Gen3 thermal
driver, so there is some consistency and I think we should aim to make
it as consistent as possible :-)
>
> [...]
>
> MBR, Sergei
--
Regards,
Niklas Söderlund
