On 7/18/07, Tim Schmidt <[EMAIL PROTECTED]> wrote:
On 7/18/07, Kenneth P. Stox <[EMAIL PROTECTED]> wrote:
> Pack the inside of the chassis with bubble wrap. It will support the
> motherboard, and other components, which will greatly reduce any strain.
Eh... I'd recommend against the bubble wrap. It will just
re-distribute forces applied to the outside of the case, and fragile
motherboard pieces (like capacitors) are likely to be on the receiving
end.
I was thinking of cutting some foam so that it would fit around the
heat sink, bracing it laterally without putting any pressure on the
mobo. I'm not sure if I have the material, though.
Most P4 heatsinks screw directly into the part of the case the
motherboard is mounted to. It should be very secure.
Not this one. A clear plastic thing that reminds me of a drywall
anchor goes through the hole, and then when you push a black tab down,
it pushes a pin through the anchor spreading out the clear plastic
thing, holding it in place. There's also like a quarter twist to the
black thing to lock it.
Note that, IIRC, if you pull the black pin back out, it's still hard
to get the clear thing out of the hole.
Best thing you can do is put the case in a large cardboard box, and
pack the box with foam or other packing material. Removing cards and
the hard drive is definitely prudent.
I've got a Dell box or two from Tech Source that I could use. I could
wrap the case in bubble wrap to make it slightly larger to fit a
little more snugly in the foam things that hold the Dell.
--
Timothy Normand Miller
http://www.cse.ohio-state.edu/~millerti
Open Graphics Project
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