[EMAIL PROTECTED] wrote:

>  Contrary to popular belief, shredded material obtained in the manner
> described above does not make good packing. Plus it adds weight to the
> package. Far better is Sealed Air bubble, or for void fill, polychips.

 My 67 300mm f/4 was wrapped in a plastic bag and packaged in a box 
filled with "packing peanuts".  I've also had samples of electronic 
components delivered this way.  Seems to offer lots of protection 
while keeping the weight down.

> I had considered going to the Sealed Air expanding foam system, but
> this is relatively expensive for the start-up costs.

 We use a system like that at work.  It looks quite messy to me and 
the stuff can't be reused or recycled.  The stuff we use has to be 
kept sealed because I think its corrosive or something.

Cheers,
- Dave

http://www.digistar.com/~dmann/ (out of date)
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