> That some call this new requirement a chessplay to > shorten the lifecycle and thus increase the turnover > is as little helping as that some claim it was invented > to keep the asian competition out. Japan started this > process 15 years ago and introduced it throughout, > apparently having solved the problems. > To me it is a task on the list.
What makes you think they have solved the problems? We won't know that until the lead-free devices have been in service for 10 years and exhibited the same or lower solder joint failure rates as lead-full devices. I have a Sony VCR that started acting flaky after about 2 years. The symptoms are consistent with intermittent solder joints. Sometimes the tuner and remote works, sometimes they don't. Mechanically the deck transport is fine. That's not right - electronics should outlast mechanicals. Best regards, Ivan Baggett Bagotronix Inc. website: www.bagotronix.com ----- Original Message ----- From: "Rene Tschaggelar" <[EMAIL PROTECTED]> To: "Protel EDA Discussion List" <[EMAIL PROTECTED]> Sent: Monday, December 06, 2004 4:06 PM Subject: Re: [PEDA] Lead free re design > Dennis, > as European, I don't have the option to stay out of the > lead free, thus I had to get some information in the last > few months. > While my pcb assembler acknowledges that he doesn't > have the proper process parameters, he said the problems > are multiple. The lifetime is reduced, because the tinn > eats the copper, meaning after about 7 years there might > be a gap between the copper trace and the tinned part. > The lead till now supressed this effect. Silver would > solve it at increased cost, beside that silver can grow > whiskers of several mm in length, thus shorting a 0603. > If the silver-tin was heated above 230 degrees that > would not happen. > The increased melting point of the new tin alloys is > between 217 and 220 degrees, whereas the lead-tin was > at 188 degrees. This can give problems with subunits > such as DC/DC converters or overized oscillators. These > shouldn't fall apart when being subject to the normal > soldering process. Meaning they internally have to be > soldered with something higher melting. With the new > 220 degree tin alloy this margin became smaller. > > There are multiple exceptions to follow the lead free. > The automobile industry is amongst them. > Ok, I could classify my products as automobile classified, > and earn less/more. But what is my customer going to do ? > > That some call this new requirement a chessplay to > shorten the lifecycle and thus increase the turnover > is as little helping as that some claim it was invented > to keep the asian competition out. Japan started this > process 15 years ago and introduced it throughout, > apparently having solved the problems. > To me it is a task on the list. > > Rene > > Dennis Saputelli wrote: > > > > > i may have posted this before but don't recall an answer > > > > someone has asked me if there are *design* issues re pc bd designs and > > the movement to lead-free > > > > i said i didn't think so, but then i wondered about the elevated > > temperatures and surface finsishes > > > > what is the proper call out for surface finish of a pcb for lead free ? > > and are there any actual design issues (as opposed to call-out issues) > > > > and also > > can you use the new lead free components in a standard 'lead-full' > > process ? (thanks for 'lead-full' Ivan) > > > > and what about cleaning under CSPs and BGAs ? > > is the standard water based OA fluz a problem ? > > seems like it would be > > > > ____________________________________________________________ > You are subscribed to the PEDA discussion forum > > To Post messages: > mailto:[EMAIL PROTECTED] > > Unsubscribe and Other Options: > http://techservinc.com/mailman/listinfo/peda_techservinc.com > > Browse or Search Old Archives (2001-2004): > http://www.mail-archive.com/[email protected] > > Browse or Search Current Archives (2004-Current): > http://www.mail-archive.com/[email protected] > ____________________________________________________________ You are subscribed to the PEDA discussion forum To Post messages: mailto:[EMAIL PROTECTED] Unsubscribe and Other Options: http://techservinc.com/mailman/listinfo/peda_techservinc.com Browse or Search Old Archives (2001-2004): http://www.mail-archive.com/[email protected] Browse or Search Current Archives (2004-Current): http://www.mail-archive.com/[email protected]
