I've made LFBGA PCB parts in protel 98 SE and I'm rather concerned or
is that befuddled? hmmmm
in any case what I have done I've been experimenting with a 4 layer
board and the (miserable) autorouter that came with it.
I've made the layer type of the pads multilayer so that each layer of
the board can connect to a pin.
Right so what's the problem?

Well there are several options for the solder mask and yet I can't see
where to specify them in the package information.  IE in the LFBGA144
package I should be able to specify a solder mask defined pad with a
solder mask hole of 0.38mm and a pad size of 0.48 mm.  I also should be
able to specify a non solder mask defined pad with solder mask hole of
0.50mm and a solder pad of 0.35mm.  

Next comes .. what trace width should I use. Currently (rightly or
wrongly) I'm attempting to use 0.125mm trace widths for connecting to
the pads.  Too large? Too small? I have been setting that as the
smallest but I'm thinking that is not as wise as I had thought before. 

Is it possible to associate a set of rules WITH a package? IE LFBGA
package automatically defines the rules for the nets that connect too
it.  Hints pointers appreciated.  I would like to have the design rules
twisted.. err pushed toward sane directions before the autorouter goes
insane err begins it's job.

In summary, how do I define the solder masked used with a specific
package, what is a proper trace width too use with 0.8 mm pitch BGA
packages, and is it possible to semi automate setting the design rules
based on package used with a net?

Stephen

Stephen R. Phillips was here
Please be advised what was said may be absolutely wrong, and hereby this 
disclaimer follows.  I reserve the right to be wrong and admit it in front of 
the entire world.

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