even with tin/lead, although solderability may be ok after cleaning they can get a spotty look which is unsatisfying cosmetically
Dennis Saputelli Brad Velander wrote: > > Good suggestion Dennis, > a reflow soldered pad will be much easier to solder a component into > at any later point in time, especially after the board has possibly gone > through several heat or reflow cycles. This would not be such an issue if > the board was plated with tin/lead and reflowed during fabrication. For OSP, > organic silver, organic tin and even some gold flash treatments this could > be critical to possible future soldering of those pads. > > Sincerely, > Brad Velander. > > Lead PCB Designer > Norsat International Inc. > #300 - 4401 Still Creek Drive, > Burnaby, B.C., Canada, V5C 6G9. > Tel (604) 292-9089 (direct line) > Fax (604) 292-9010 > Website: www.norsat.com > > -----Original Message----- > From: Dennis Saputelli [mailto:[EMAIL PROTECTED]] > Sent: Friday, January 11, 2002 9:22 AM > To: Protel EDA Forum > Subject: Re: [PEDA] closing pads on paste mask > > more than one assembler has advised me to let unpopulated parts be > solder pasted and reflowed as if there were parts on them > the reason given was that the pads if not pasted get tarnished and > crummy looking > (it's also easier!) > > Dennis Saputelli -- ___________________________________________________________________________ www.integratedcontrolsinc.com Integrated Controls, Inc. tel: 415-647-0480 2851 21st Street fax: 415-647-3003 San Francisco, CA 94110 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
