Does anyone have pointers to footprint guidelines for Power Pad parts, particularly TSSOP (28 pin in this case).
If I put a pad down the same size as the powerpad and screen solder onto it, I would expect the part to sit up on the meniscus when the solder melts and I'd get poor/missed joints at the pins. I would have expected to have a pad the same size as the power pad but to only screen a tiny bit of solder on to it. This is all conjecture and I didn't find anything useful with Google or my usual PCB links. Anyone know more about these things ? Steve. ====================================================== Steve Baldwin Electronic Product Design TLA Microsystems Ltd Microcontroller Specialists PO Box 15-680, New Lynn http://www.tla.co.nz Auckland, New Zealand ph +64 9 820-2221 email: [EMAIL PROTECTED] fax +64 9 820-1929 ====================================================== * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
