Hi everyone,

    I'm making a 54-BALL VFBGA (8mm x 9mm) package.  From a Micron ram chip 
MT48V8M16LFFF.

PDF = http://download.micron.com/pdf/datasheets/dram/MobileY95W_3V_E.pdf

In the mechanical package description, it says:

54x /O 0.35 solder ball diameter to post reflow condition.  The pre-reflow diameter is 
/O 0.33.

Elsewhere, the spec says that the Solder ball pad: /O .27mm.

This is all that we are told with regard to the pad size.
Does this mean that the land pattern should be 0.33mm, or 0.35mm?
What should the solder mask & paste stencil be cut out to?

____________
Brian Guralnick
[EMAIL PROTECTED]
Voice (514) 624-4003
Fax (514) 624-3631




************************************************************************
* Tracking #: 992F98E7AE588742804A14E4855774107E255816
*
************************************************************************

* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
* To post a message: mailto:[EMAIL PROTECTED]
*
* To leave this list visit:
* http://www.techservinc.com/protelusers/leave.html
*
* Contact the list manager:
* mailto:[EMAIL PROTECTED]
*
* Forum Guidelines Rules:
* http://www.techservinc.com/protelusers/forumrules.html
*
* Browse or Search previous postings:
* http://www.mail-archive.com/proteledaforum@techservinc.com
* * * * * * * * * * * * * * * * * * * * * * * * * * * * * *

Reply via email to