Hi everyone,
I'm making a 54-BALL VFBGA (8mm x 9mm) package. From a Micron ram chip
MT48V8M16LFFF.
PDF = http://download.micron.com/pdf/datasheets/dram/MobileY95W_3V_E.pdf
In the mechanical package description, it says:
54x /O 0.35 solder ball diameter to post reflow condition. The pre-reflow diameter is
/O 0.33.
Elsewhere, the spec says that the Solder ball pad: /O .27mm.
This is all that we are told with regard to the pad size.
Does this mean that the land pattern should be 0.33mm, or 0.35mm?
What should the solder mask & paste stencil be cut out to?
____________
Brian Guralnick
[EMAIL PROTECTED]
Voice (514) 624-4003
Fax (514) 624-3631
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