No choice.  The very low power SDRAMS have very small packages.  You know, for PDAs & 
other ridiculously compact devices.
Thankfully, there are only 54 contacts, not something like 500-1000...

____________
Brian Guralnick
[EMAIL PROTECTED]
Voice (514) 624-4003
Fax (514) 624-3631


----- Original Message -----
From: "Dennis Saputelli" <[EMAIL PROTECTED]>
To: "Protel EDA Forum" <[EMAIL PROTECTED]>
Sent: Monday, September 09, 2002 1:54 PM
Subject: Re: [PEDA] BGA Footprint question.


> that's pretty small!
> i would talk to your assembler, i have found that different ones have
> different opinions
>
> Dennis Saputelli
>
>
> Brian Guralnick wrote:
> >
> > Hi everyone,
> >
> >     I'm making a 54-BALL VFBGA (8mm x 9mm) package.  From a Micron ram chip 
>MT48V8M16LFFF.
> >
> > PDF = http://download.micron.com/pdf/datasheets/dram/MobileY95W_3V_E.pdf
> >
> > In the mechanical package description, it says:
> >
> > 54x /O 0.35 solder ball diameter to post reflow condition.  The pre-reflow 
>diameter is /O 0.33.
> >
> > Elsewhere, the spec says that the Solder ball pad: /O .27mm.
> >
> > This is all that we are told with regard to the pad size.
> > Does this mean that the land pattern should be 0.33mm, or 0.35mm?
> > What should the solder mask & paste stencil be cut out to?
> >
> > ____________
> > Brian Guralnick
> > [EMAIL PROTECTED]
> > Voice (514) 624-4003
> > Fax (514) 624-3631
> >
>
>
> ************************************************************************
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> *
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> www.integratedcontrolsinc.com            Integrated Controls, Inc.
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