that's pretty small! i would talk to your assembler, i have found that different ones have different opinions
Dennis Saputelli Brian Guralnick wrote: > > Hi everyone, > > I'm making a 54-BALL VFBGA (8mm x 9mm) package. From a Micron ram chip >MT48V8M16LFFF. > > PDF = http://download.micron.com/pdf/datasheets/dram/MobileY95W_3V_E.pdf > > In the mechanical package description, it says: > > 54x /O 0.35 solder ball diameter to post reflow condition. The pre-reflow diameter >is /O 0.33. > > Elsewhere, the spec says that the Solder ball pad: /O .27mm. > > This is all that we are told with regard to the pad size. > Does this mean that the land pattern should be 0.33mm, or 0.35mm? > What should the solder mask & paste stencil be cut out to? > > ____________ > Brian Guralnick > [EMAIL PROTECTED] > Voice (514) 624-4003 > Fax (514) 624-3631 > ************************************************************************ * Tracking #: 709F790AA8A5A04AB22D7874AA0F74C836B673FD * ************************************************************************ -- ___________________________________________________________________________ www.integratedcontrolsinc.com Integrated Controls, Inc. tel: 415-647-0480 2851 21st Street fax: 415-647-3003 San Francisco, CA 94110 * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
