Hi all
I like that idea - in this way we can do it really affordable with lower end
FPGAs and still compatible with MTCA.
If we place all RF stuff on the modules, with RF connectors mounted directly
on the front panel, this could work.
How we would deliver the clocks? Using external SMA
Such assembly technique is called:
castellated PCB module
https://www.google.pl/search?q=castellated+RF+modules=1920=917=lnms=isch=X=0ahUKEwjRvuqko-nLAhWnnXIKHe_IARsQ_AUIBygB
Actually HPC with LPC IO assignment and 8 x GTP links is popular
configuration
So you have 34 LVDS pairs and 8 GTP links.
On 30 March 2016 at 23:00, Slichter, Daniel H. (Fed) <
daniel.slich...@nist.gov> wrote:
> > On Wed, Mar 30, 2016 at 10:25 PM, Slichter, Daniel H. (Fed)
> >
On Tuesday, 29 March 2016 11:14:14 PM HKT Grzegorz Kasprowicz wrote:
> [GK] If you don't use ARM, you still get hardened SDRAM controller and
> GBE MACs.
Yes, that's what I was saying: you cannot get rid of them (i.e. use their
pins like other IOs). So you need to use the Zynq-specific
Maybe we should come back to the roots:)
What if we use standard FMCs (LPC) with DAC/ADC channels and RF stuff _on_ them.
JESD204B and some pins would go to the FPGA while DAC and RF clock would be fed
externally.
In this way we leave general purpose AMC board and define its functionality by
FMC
Actually HPC with LPC IO assignment and 8 x GTP links is popular configuration
So you have 34 LVDS pairs and 8 GTP links.
If this works for you then I don’t have major objections. The other issue to
consider is power rails, since for the analog circuitry we will probably want
+/- 5V, +/- 15V
Well, it depends on trace width matching. We can simulate and characterize
it even at much higher frequencies.
If we place them really close to the DAC and match widths, remove grounds
under pads, we can match it not worse than SMA connectors.
We can even do even more crazy thing - try to make
So now we are moving towards complying with the AMC FMC physical standard. Is
this something we want to do? There are pluses (able to use existing AMC FMC
cards) and minuses (squeezing things in more tightly than we otherwise might
have to).
From: Grzegorz Kasprowicz
Are we talking about double width AMCs?
Two DAC channels and 2 RF modules should fit.
Greg
-Original Message-
From: Sébastien Bourdeauducq [mailto:s...@m-labs.hk]
Sent: Wednesday, March 30, 2016 5:46 PM
To: Leibrandt, David R. (Fed)
Cc: Grzegorz Kasprowicz
OK, I see your point
On 30 March 2016 at 23:17, Slichter, Daniel H. (Fed) <
daniel.slich...@nist.gov> wrote:
> We definitely need +/- 15V for the low frequency (e.g. trap electrode)
> amplifiers. Many low noise amplifiers and RF components run off +5V or +/-
> 5V and have substantial current
> Maybe we should come back to the roots:) What if we use standard FMCs
> (LPC) with DAC/ADC channels and RF stuff _on_ them.
> JESD204B and some pins would go to the FPGA while DAC and RF clock would
> be fed externally.
> In this way we leave general purpose AMC board and define its
Well, we can do another crazy thing - solder small module with RF stuff on
the FMC board, under same shield.
In this way we keep 3 simple FMCs with expensive ADCs/DACs and define the
functionality by soldering (automatic or manual) of just RF modules. WE can
even design such modules to hold the
> On Wed, Mar 30, 2016 at 10:25 PM, Slichter, Daniel H. (Fed)
> wrote:
> > Now, as you suggest we could just change the level at which we make this
> break from the AMC card, shift the DACs and ADCs onto the daughter card as
> well, and use FMC to communicate with the
Actually, we can fit a lot to single FMC
Look here:
https://scontent-waw1-1.xx.fbcdn.net/hphotos-xpa1/v/t1.0-9/66620_1649317561668_2595483_n.jpg?oh=982ee50c1a1d8ecc444346c9eae1fe1c=578FA78C
I managed to place there 16 AFEs, 16x130MHz ADCs, 16 buffers, FPGA, SDRAM, quad
DAC with amplifier, SMPS
On Wed, Mar 30, 2016 at 10:25 PM, Slichter, Daniel H. (Fed)
wrote:
> Now, as you suggest we could just change the level at which we make this
> break from the AMC card, shift the DACs and ADCs onto the daughter card as
> well, and use FMC to communicate with the whole
On Wed, Mar 30, 2016 at 10:22 PM, Grzegorz Kasprowicz
wrote:
> Actually, we can fit a lot to single FMC
> Look here:
> https://scontent-waw1-1.xx.fbcdn.net/hphotos-xpa1/v/t1.0-9/66620_1649317561668_2595483_n.jpg?oh=982ee50c1a1d8ecc444346c9eae1fe1c=578FA78C
> I managed to place
We could also use a fuzz button interposer, which would do the same kind of
task (low stacking height connection w/ high frequency compatibility), but I
think once we start heading too far down this road the cost and complexity of
making a robust solution starts to outweigh the cost of just
On Wed, Mar 30, 2016 at 5:57 PM, Slichter, Daniel H. (Fed)
wrote:
>> > What are you thinking for number of daughter cards? I suppose that
>> > more would give us more flexibility, but less would be more economical
>> > in terms of cost and layout area. Perhaps two
> Impressive. Yep. Looks doable then. For us it would probably be either just
> filtering and amplification on four channels, or upconversion (on two iq
> channels then i would think).
Agreed, seems doable. Filtering plus amplification should fit in a suitable
footprint pretty easily. Two
On Wednesday, 30 March 2016 9:37:51 PM HKT Grzegorz Kasprowicz wrote:
> Well, you don't have to write it.
> It is already available for RTOS and linux.
We are not using RTOS or Linux.
> But it's true - it occupies MIO bank and dedicated DDR port. But this is axi
> and can be easily accessible
One further question: is there a plan to make a “TTL” card or a multichannel
“slow” DAC card (e.g. for trap voltages), using a Centronics or d-sub type
connector? These could both be more readily accomplished with their own FMC
modules if we go with this architecture.
From: Grzegorz
Looks like one could get a pretty good start on things by just copying the
designs used by marki microwave:
http://www.markimicrowave.com/assets/packages/CTG.pdf
http://www.markimicrowave.com/assets/appnotes/an-ct-pcb.pdf
On another note, I would recommend the MM1-0320HSM mixer as a good option
On Tuesday, 29 March 2016 11:14:14 PM HKT Grzegorz Kasprowicz wrote:
> [GK] If you don't use ARM, you still get hardened SDRAM controller and GBE
> MACs.
Yes, that's what I was saying: you cannot get rid of them (i.e. use their pins
like other IOs). So you need to use the Zynq-specific features
I like this plan. I think 4 + 4 channels will also make the front panel
connector density more reasonable. What are you thinking for number of
daughter cards? I suppose that more would give us more flexibility, but less
would be more economical in terms of cost and layout area. Perhaps two
> I like this plan. I think 4 + 4 channels will also make the front panel
> connector
> density more reasonable. What are you thinking for number of daughter
> cards? I suppose that more would give us more flexibility, but less would be
> more economical in terms of cost and layout area.
> > What are you thinking for number of daughter cards? I suppose that
> > more would give us more flexibility, but less would be more economical
> > in terms of cost and layout area. Perhaps two daughter cards would be
> reasonable:
> > one for all of the inputs and one for all of the outputs?
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