In a message dated 2/4/2002, Chris Maxwell writes:
What would happen (assuming 60950) if you had AC on the component side
of a board and SELV on the solder side. (assuming that any through holes
were properly cleared out).
Hi Chris:
That usually works out fine, since the board is
...@aol.com'; rbus...@es.com
Cc: emc-p...@majordomo.ieee.org
Subject: RE: Pollution Degree vs. Creapage Distance
Just some anecdotal info . . .
There was an occassion at a previous employ where, due to a brief
mental
hiccup on the part of several folks, a printed circuit get fabricated
]On Behalf Of rbus...@es.com
Sent: Friday, February 01, 2002 6:41 PM
To: rpick...@hypercom.com
Cc: emc-p...@ieee.org
Subject: RE: Pollution Degree vs. Creapage Distance
Thanks for the response and yes I was referring to EN60950. My
apologies for not stating that in my message.
I guess I was thinking
- Original Message -
From: John Juhasz
To: 'j...@aol.com' ; rbus...@es.com
Cc: emc-p...@majordomo.ieee.org
Sent: Friday, February 01, 2002 11:30 AM
Subject: RE: Pollution Degree vs. Creapage Distance
Just some anecdotal info . . .
There was an occassion at a previous employ where
In a message dated 2/1/2002, John Juhasz writes:
In short, they noted that while possible, it is difficult to maintain the
pollution degree 1 in a printed circuit. Typically the pollution degree
is applied to 'potted' items.
Hi John:
In the first edition of EN 60950 there was little
...@majordomo.ieee.org
Subject: Re: Pollution Degree vs. Creapage Distance
In a message dated 1/31/2002, Rick Busche writes:
Does the application of a solder mask allow for a change from pollution
degree 2 to pollution degree 1? I understand that conformal coating
requires significant testing when
...@hypercom.com]
Sent: Friday, February 01, 2002 9:22 AM
To: Rick Busche
Cc: emc-p...@ieee.org
Subject: Re: Pollution Degree vs. Creapage Distance
Hi Rick,
I am assuming (ugh) that you are referring to EN60950 2nd Edition. If so,
clause 2.9.6 clearly
addresses your question by requiring hermetic
In a message dated 1/31/2002, Rick Busche writes:
Does the application of a solder mask allow for a change from pollution
degree 2 to pollution degree 1? I understand that conformal coating
requires significant testing when used to reduce spacings per table 7, but
in this case I am only
: Pollution Degree vs. Creapage Distance
Hi Rick,
I am assuming (ugh) that you are referring to EN60950 2nd Edition. If so,
clause 2.9.6 clearly
addresses your question by requiring hermetic sealing or such enclosing to
prevent the ingress of
dirt and/or moisture. IMHO, solder mask does
Hi Rick,
I am assuming (ugh) that you are referring to EN60950 2nd Edition. If so,
clause 2.9.6 clearly
addresses your question by requiring hermetic sealing or such enclosing to
prevent the ingress of
dirt and/or moisture. IMHO, solder mask does not and cannot provide this type
of
I read in !emc-pstc that rbus...@es.com wrote (in 1D0833CB3B1D7244B617A
0DC8399C27E174905@vega) about 'Pollution Degree vs. Creapage Distance',
on Thu, 31 Jan 2002:
I am wading through the creapage and clearance requirements for secondary
circuits using the values in tables 5 and 6.
Tables 5
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