Waldemar Kulajew wrote:
Mr. Baggett,
some answers for your questions 3 and 4.
My experience is either to tent the vias only half or tenting them with
selkscreen (if this is the right word for the lacquer used to show the
component-positions).
1) The first Idea means to
What about the issue of whether to use a solder mask around the BGA ball
land patterns? I though I read somewhere that there are pros and cons about
this as it might cause ball breakdown during placement. If so, what would
be the correct SM diameter to use with a 25-mil ball land?
Tim
Ivan,
I just looked at this a short while ago. I am also using a 388 1.27mm PBGA,
by AMD - ELANSC520. We are intending to tent the Vias as the folks on this
group suggested. I have noticed your Via pad is smaller than we were asked
to use by our fab house. We were asked to use 0.71mm pad and
4) If (1) is yes, what do I tell the PCB fab house to get them to tent the
vias? Is it as simple as tent the vias?
You select the vias, and check the box marked tenting in their property
page. The Protel won't remove solder mask in the gerber.
Rob
* * * * * * * * * * * * * * * * * *
allows you to tent vias simply
by checking the tented check box on the via properties pane.
Cheers,
John Haddy
-Original Message-
From: Bagotronix Tech Support [mailto:[EMAIL PROTECTED]]
Sent: Thursday, 23 August 2001 4:36 AM
To: Protel EDA Forum
Subject: [PEDA] tenting vias
