What about the issue of whether to use a solder mask around the BGA ball
land patterns?  I though I read somewhere that there are pros and cons about
this as it might cause ball breakdown during placement.  If so, what would
be the correct SM diameter to use with a 25-mil ball land?

Tim Hutcheson
Institute for Human and Machine Cognition
40 S. Alcaniz St.
Pensacola, FL.  32503

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