Waldemar Kulajew wrote:
> Mr. Baggett,
>
> some answers for your questions 3 and 4.
> My experience is either to tent the vias only half or tenting them with
> selkscreen (if this is the right word for the lacquer used to show the
> component-positions).
> 1) The first Idea means to use a soldermask covering the pad but leaving the
> holes open. Because my manufacturer told me not to use completely tented vias
> with HAL-soldering (I am still using HotAirLeveling-process) for the air in the
> via burst open the soldermask.
A solution for this is to tent the via only on the side where it is neede, ie. the
BGA side.
Jon
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