Leo,
A belated thanks for the response.
Your link roughly agrees with an application note I found from Micrel.
Micrel's application note has a chart showing Thermal Resistance vs. Pad Area. I'm
not sure how they came up with it, but it feels correct enough to help keep
me out of trouble.
At 08/10/2003 18:12, [EMAIL PROTECTED] wrote:
Hi,
I'd like to use a large, unmasked, plated, copper pour, on a single layer, to
perform as a heat sink for a D-Pak regulator.
I need to quantify the thermal resistance of the copper pour to ambient. I
know it's based on copper thickness and copper
[EMAIL PROTECTED] wrote:
Hi,
I'd like to use a large, unmasked, plated, copper pour, on a single layer, to
perform as a heat sink for a D-Pak regulator.
I need to quantify the thermal resistance of the copper pour to ambient. I
know it's based on copper thickness and copper area. I'm
Hi,
I'd like to use a large, unmasked, plated, copper pour, on a single layer, to
perform as a heat sink for a D-Pak regulator.
I need to quantify the thermal resistance of the copper pour to ambient. I
know it's based on copper thickness and copper area. I'm uncertain how to boil
down to
