Thanks Harry,
It all makes sense now.
Cheers
Mark
At 12:21 AM 11/25/2002 -0800, you wrote:
Hi Mark -
Go back and look at the Bulwith paper again. The recommendation is 5 to
15 micro INCHES. It's the old problem of we Yanks vs the rest of the
world in units. Converted to rest of the world
Hi Mark -
Go back and look at the Bulwith paper again. The recommendation is 5 to 15
micro INCHES. It's the old problem of we Yanks vs the rest of the world in
units. Converted to rest of the world units, Bulwith is recommending 0.13
- 0.38um which is well inside the NPL calculations. Many
Thanks Harry,
I've read both papers below and don't see how they agree. The NPL
paper has 2 charts that max out at 3um gold pad thickness.Now I was
told that the solder paste stencils that my company uses are 5 to 6 mils
(127 to 152um) thick. If this is the case the maximum thic
Hi Mark,
Here are two links to papers that discuss the subject of soldering to gold
plated PCB's. The first is theoretical, and the second is practical (they
agree with one another). The guidelines you are looking for are on the
last page of the second paper.
http://www.npl.co.uk/ei/document
Mark,
this is something that I had looked into closely over the years. We
have posted previously about this on the PEDA group so you may be able to
search the PEDA Yahoo archives and find more but here are my comments from a
previous thread on this issue.
"April 23 2002,
Re: [PEDA] Gold is
Mark,
Here is the note I use for gold on boards
with switch contact patterns where whole board
is gold.
However I believe IPC does have data on this
if you want to check into it further.
www.ipc.org.
b. Immersion Gold;
* For printed circuit switch contacts board shall be plated with
0.0001
