Mark,
Here is the note I use for gold on boards
with switch contact patterns where whole board
is gold.
However I believe IPC does have data on this
if you want to check into it further.
www.ipc.org.
b. Immersion Gold;
* For printed circuit switch contacts board shall be plated with
0.000100-0.000150 inch (100-150 uIn) 100uIn minimum thickness of low
stress nickel
followed by 0.000004-0.000006 inch (4-6 uIn) 4 uIn minimum thickness of
gold.
Bob Wolfe
----- Original Message -----
From: "Mark witherite" <[EMAIL PROTECTED]>
To: "Protel EDA Forum" <[EMAIL PROTECTED]>
Sent: Friday, November 22, 2002 6:56 AM
Subject: [PEDA] Gold embrittlement in solder joints
>
>
> Hi Everyone,
> Does anyone know the maximum recommended plating thickness you
can
> use for gold with out causing gold embrittlement in the solder joint. My
> application is for BGAs. I attended a class and PCB east a few years ago
> and was introduced to a new term "Sacrificial Gold platting" . I
> interpreted it to mean the minimum thickness required to prevent
oxidation
> and not cause embrittlement of the solder joint. So does anyone know
what
> thickness I should speck for my boards?
> Thanks
> Mark
>
>
>
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