Re: [Vo]:Mizuno latest
I believe that Mizuno heated the ceramic to 700-800C with Pd ire of small dimension. The surface temperature of the wire could easily exceed 1400C From: Russ George Sent: Monday, September 4, 2017 12:16 PM To: vortex-l@eskimo.com Subject: RE: [Vo]:Mizuno latest Bob, One can sputter the daylight with Pd in a simple D2 plasma under very simple conditions! From: Bob Higgins [mailto:rj.bob.higg...@gmail.com] Sent: Monday, September 4, 2017 11:42 AM To: vortex-l@eskimo.com Subject: [Vo]:Mizuno latest Jed, can I make a request? Acknowledging your fluency in Japanese and relationship with Mizuno ... In Mizuno's paper, he describes the deposition the preparation of the Ni and the Pd with a good deal of text, but in the final part of the preparation (page 8, figure 10) he describes heating the ceramic heater wrapped in Pd wire to 700-800°C for 10-20 hours to deposit Pd on the Ni surface. This may be the most important part of the process, yet he only spent 1 small paragraph describing the deposition. The melting point of Pd is 1550°C and the boiling point of Pd is 2960°C. Clearly, at the specified temperature of the ceramic heater, the vapor pressure of the Pd is very, very low. So, without plasma, it is hard to understand how any Pd is deposited at all. Mizuno only describes D2 as being in the chamber - there is no Ar that is normally used in sputtering (energetic Ar ions are used in sputtering to have a better probability of knocking off atoms of the metal due to the high mass of Ar). Mizuno doesn't describe a DC plasma condition that would have been used for striking a glow near the ceramic heater with Pd wire for deposition. Can you ask Mizuno if he can provide an explanation of the mechanism of Pd deposition used in conjunction with the ceramic heater wound with the Pd wire? Was it an evaporation process, sputtering, or ion plating technique? Was a plasma active during the Pd deposition? Was it a deuterium plasma? Was there a DC voltage applied between the heated Pd wire and the cathode? Also, Mizuno shows SEM photos of the Ni mesh cathode surface before and after the treatment. The after photo shows micron scale bulbous growth that I surmise from his deposition method cannot be all Pd. It appears that the surface morphology of the Ni has been vastly altered, and probably has only a small film thickness of Pd on top of that. His Ni mesh cathode has a lot of area, and he only has a small amount of Pd wire on the ceramic heater. Can you ask Mizuno what he believes is the thickness of Pd that he has deposited by his final deposition process? I.E. in Figure 32, how thick is the Pd film on top of the Ni? Regards - Bob Higgins
Re: [Vo]:Mizuno latest
Bob Higgins wrote: > In Mizuno's paper, he describes the deposition the preparation of the Ni > and the Pd with a good deal of text, but in the final part of the > preparation (page 8, figure 10) he describes heating the ceramic heater > wrapped in Pd wire to 700-800°C for 10-20 hours to deposit Pd on the Ni > surface. > That was the previous method. I do not think it ended up depositing much Pd on the Ni. Or, I should say I think it ended up depositing Pd all over the place. In Appendix A he describes two newer methods, in step 3: Rub the surface with pure palladium. The palladium will adhere to the mesh. Alternatively, the palladium can be plated onto the mesh (plating solution: Tanaka, Inc., PDMO2LB). This is the key step. In an industrial process, a similar material might be fabricated by some other method such as Nano-sintering. Anyway, I will ask him about this. - Jed
Re: [Vo]:Mizuno latest
Hi Russ - Yes, that may be true, but Mizuno did not talk about sputtering during the final deposition. Should we presume there was a bias and a deuterium plasma? I hate missing details. On Mon, Sep 4, 2017 at 10:16 AM, Russ George wrote: > Bob, > > > > One can sputter the daylight with Pd in a simple D2 plasma under very > simple conditions! > > > > *From:* Bob Higgins [mailto:rj.bob.higg...@gmail.com] > *Sent:* Monday, September 4, 2017 11:42 AM > *To:* vortex-l@eskimo.com > *Subject:* [Vo]:Mizuno latest > > > > Jed, can I make a request? Acknowledging your fluency in Japanese and > relationship with Mizuno ... > > In Mizuno's paper, he describes the deposition the preparation of the Ni > and the Pd with a good deal of text, but in the final part of the > preparation (page 8, figure 10) he describes heating the ceramic heater > wrapped in Pd wire to 700-800°C for 10-20 hours to deposit Pd on the Ni > surface. This may be the most important part of the process, yet he only > spent 1 small paragraph describing the deposition. > > The melting point of Pd is 1550°C and the boiling point of Pd is 2960°C. > Clearly, at the specified temperature of the ceramic heater, the vapor > pressure of the Pd is very, very low. So, without plasma, it is hard to > understand how any Pd is deposited at all. Mizuno only describes D2 as > being in the chamber - there is no Ar that is normally used in sputtering > (energetic Ar ions are used in sputtering to have a better probability of > knocking off atoms of the metal due to the high mass of Ar). Mizuno > doesn't describe a DC plasma condition that would have been used for > striking a glow near the ceramic heater with Pd wire for deposition. > > *Can you ask Mizuno if he can provide an explanation of the mechanism of > Pd deposition used in conjunction with the ceramic heater wound with the Pd > wire? Was it an evaporation process, sputtering, or ion plating > technique? Was a plasma active during the Pd deposition? Was it a > deuterium plasma? Was there a DC voltage applied between the heated Pd > wire and the cathode?* > > Also, Mizuno shows SEM photos of the Ni mesh cathode surface before and > after the treatment. The after photo shows micron scale bulbous growth > that I surmise from his deposition method cannot be all Pd. It appears > that the surface morphology of the Ni has been vastly altered, and probably > has only a small film thickness of Pd on top of that. His Ni mesh cathode > has a lot of area, and he only has a small amount of Pd wire on the ceramic > heater. > > *Can you ask Mizuno what he believes is the thickness of Pd that he has > deposited by his final deposition process? I.E. in Figure 32, how thick is > the Pd film on top of the Ni? * > > > > Regards - Bob Higgins >
RE: [Vo]:Mizuno latest
Bob, One can sputter the daylight with Pd in a simple D2 plasma under very simple conditions! From: Bob Higgins [mailto:rj.bob.higg...@gmail.com] Sent: Monday, September 4, 2017 11:42 AM To: vortex-l@eskimo.com Subject: [Vo]:Mizuno latest Jed, can I make a request? Acknowledging your fluency in Japanese and relationship with Mizuno ... In Mizuno's paper, he describes the deposition the preparation of the Ni and the Pd with a good deal of text, but in the final part of the preparation (page 8, figure 10) he describes heating the ceramic heater wrapped in Pd wire to 700-800°C for 10-20 hours to deposit Pd on the Ni surface. This may be the most important part of the process, yet he only spent 1 small paragraph describing the deposition. The melting point of Pd is 1550°C and the boiling point of Pd is 2960°C. Clearly, at the specified temperature of the ceramic heater, the vapor pressure of the Pd is very, very low. So, without plasma, it is hard to understand how any Pd is deposited at all. Mizuno only describes D2 as being in the chamber - there is no Ar that is normally used in sputtering (energetic Ar ions are used in sputtering to have a better probability of knocking off atoms of the metal due to the high mass of Ar). Mizuno doesn't describe a DC plasma condition that would have been used for striking a glow near the ceramic heater with Pd wire for deposition. Can you ask Mizuno if he can provide an explanation of the mechanism of Pd deposition used in conjunction with the ceramic heater wound with the Pd wire? Was it an evaporation process, sputtering, or ion plating technique? Was a plasma active during the Pd deposition? Was it a deuterium plasma? Was there a DC voltage applied between the heated Pd wire and the cathode? Also, Mizuno shows SEM photos of the Ni mesh cathode surface before and after the treatment. The after photo shows micron scale bulbous growth that I surmise from his deposition method cannot be all Pd. It appears that the surface morphology of the Ni has been vastly altered, and probably has only a small film thickness of Pd on top of that. His Ni mesh cathode has a lot of area, and he only has a small amount of Pd wire on the ceramic heater. Can you ask Mizuno what he believes is the thickness of Pd that he has deposited by his final deposition process? I.E. in Figure 32, how thick is the Pd film on top of the Ni? Regards - Bob Higgins
