On Sep 9, 2007, at 5:39 AM, Jones Beene wrote:
What am I missing about H2 that would be a negative in this role? Yes many materials are hydrided by contact but in a situation of low heat (!300 k), and using gold plating on the acceptor and a nitrided donor, then it would seem that the hydride could be avoided. Anything else?
I think if gold plating is used much of the energy will be lost by electrons crossing the gold-acceptor interface. This is why I suggested operating in pulse mode with a capacitive link between the metal types, or at least the possible value of a tunneling barrier between the gold (or platinum) acceptor and the donor. I am not sure the tunneling interface would actually work, whereas the pulse mode operated capacitive interface looks like a winner.
Horace Heffner http://www.mtaonline.net/~hheffner/
