On Thu, Mar 12, 2015 at 5:50 PM, Jason Barnett <[email protected]> wrote: > I have to disagree with Brad on this one. It is vital to get the proper > amount of solder on the center ground pad. Too much paste will cause solder > balls (and shorts under the pins) and too little paste will cause your > component to fail due to thermal stress. We have been dealing with this > issue lately at my company.
Well proper is the key here, isn't it? I just know that I've had problems using QFN10 mylar stencils with the ground pad cut the full size of the pad itself. Maybe it was the board I was doing but I had a real hard time getting the correct amount of paste across the board until I reduced the size of the QFN ground (if I used less pressure for the QFN the other pads didn't have enough paste). And I believe that when putting paste down by hand it's easy to use too much. As always, your mileage may vary and objects in the mirror may be closer than they appear. Regards, Brad. _______________________________________________ dorkbotpdx-blabber mailing list [email protected] http://music.columbia.edu/mailman/listinfo/dorkbotpdx-blabber
