On 5/27/10 4:05 PM, wren wrote:
Hi all,
I'm in the middle of surgery now. So far so good. Just removed the
heat sink. When I flipped it over, I expected to see some copper
contacts like the ones pictures on the generic ifixit heat sink.
However, there are none. It does have a black square that looks like
it was in contact with the processor, however, there is no residue
from previous paste on it. Is this what I'm supposed to see? I
expected to see copper and a lot of residue to scrape off. When I get
to the stage of re-assembly, do I simply add the paste onto that small
black square that contacts the processor? It is about 1-1/2 cm wide,
I'd guess. Thought I better ask before I get that far - in case no one
is near their computer instantly.
There are two different styles of heat sink for the processor that I
have seen. One is metal with fins, the other is a dark composite
material. I don't think the Pismos were initially assembled with paste.
If you examine that dark square carefully, you may find that it is
elastomeric - the processor is pressed into the 'rubber' to get good
contact. When I reassembled my Pismos, I did use heat sink compound, on
the theory that, if my alignment of the heat sink upon reassembly wasn't
'exact', and the 'rubber' had some memory effects, the thermal paste
would fill any small voids.
- Don
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