On Fri, Mar 13, 2009 at 9:49 AM, dc <[email protected]> wrote: > > I'm not a big fan of the sticky black goop Apple uses for thermal > compound. When I swap processors, which is pretty frequent, I always > replace it with a better compound. First I remove the black stuff with > a plastic (not metal- don't scratch the heatsink or CPU) scraper, > scrub it off with acetone (or nail polish remover) and then wipe it > with rubbing alcohol. I then apply Arctic Silver Ceramique; it's non- > conductive and seems to do a very good job transferring the heat from > the CPU t the heatsink. I haven't fried any CPUs yet. > > ________________________________________ >
Overclockers who are set on defeating heat to preserve costly CPUs yet squeeze extreme clock counts out of them have been known to polish the CPU and heatsink with ever finer grades of wet or dry paper starting with 1000 grit. And even going to finer grits of polishing compound. Some may even " lap : the surfaces together with a polishing compound. Then they apply the thermal paste after all of that. In theory the more closely the parts surfaces match and the thinner the paste needed to make up the difference the faster and therefore the more successful the heat transfer will be. --~--~---------~--~----~------------~-------~--~----~ You received this message because you are subscribed Low End Mac's G3-5 List, a group for those using G3, G4, and G5 desktop Macs - with a particular focus on Power Macs. The list FAQ is at http://lowendmac.com/lists/g-list.shtml and our netiquette guide is at http://www.lowendmac.com/lists/netiquette.shtml To post to this group, send email to [email protected] To unsubscribe from this group, send email to [email protected] For more options, visit this group at http://groups.google.com/group/g3-5-list?hl=en Low End Mac RSS feed at feed://lowendmac.com/feed.xml -~----------~----~----~----~------~----~------~--~---
