On Mar 14, 2009, at 8:25 AM, PeterH wrote: > >> > > For the LGA 775 products from Intel, which present a very large > surface area to the cooler, the most popular method of "extreme > cooling" is "lapping" the processor and the cooler to flatness, > followed by application of the best available heat transfer compound.
This process of Lapping is used on musical instruments as well to fit a trumpet or other piston/valve into its own personal cylinder ... uses the surfaces that will be touching in the end, or living together, and a lapping compound (sometimes even toothpaste...), to bring the 2 surfaces shapes closer together ... then uses a valve oil to seal and lubricate the result. These valves require air tight fit (seal) and a friction free movement (lubricated) for rapid repositioning during making music. Just some comments on Lapping two surfaces ... which I have only seen done ... I think I'm going to leave my QS Dual 1GHz alone, unless it starts having kps I cannot explain otherwise ... was considering "preventive maintenance" idea of replacing the thermal connection being discussed herein ... Bill Connelly artsite: http://mysite.verizon.net/moonstoneartstudio myspace: http://www.myspace.com/moonstoneartstudio --~--~---------~--~----~------------~-------~--~----~ You received this message because you are subscribed Low End Mac's G3-5 List, a group for those using G3, G4, and G5 desktop Macs - with a particular focus on Power Macs. The list FAQ is at http://lowendmac.com/lists/g-list.shtml and our netiquette guide is at http://www.lowendmac.com/lists/netiquette.shtml To post to this group, send email to g3-5-list@googlegroups.com To unsubscribe from this group, send email to g3-5-list-unsubscr...@googlegroups.com For more options, visit this group at http://groups.google.com/group/g3-5-list?hl=en Low End Mac RSS feed at feed://lowendmac.com/feed.xml -~----------~----~----~----~------~----~------~--~---
