-----Original Message----- From: IBM Mainframe Discussion List [mailto:[EMAIL PROTECTED] On Behalf Of David Andrews Sent: Tuesday, September 12, 2006 10:16 AM To: [email protected] Subject: Re: Non-SMP/e packaging <snip> Of course, this would be an effort *much* larger than simply providing "proper packaging". IDP would have to adapt its internal change management procedures to coexist with SMP -- probably an awful lot of work and local development upheaval. <snip>
In a certain company's case, the change to SMP/E support allowed them to go to source level maint. The number of fixes done by ZAP that some how never got converted to source was a thorn in their side. In that case, going to SMP/E based support was both simple and greatly desired (internally) and answered a request by several of their customers. However, your point is quite right. For certain companies with certain products, it would take some time to change (with quite some effort) to a change control system to match to the APAR/PTF scheme needed by SMP. And it may not even be possible to change their current system so that they would have to develop a new system. And while doing this, they would have to make sure they didn't break things for their currently supported products and customers. A conundrum. Later, Steve Thompson ---------------------------------------------------------------------- For IBM-MAIN subscribe / signoff / archive access instructions, send email to [EMAIL PROTECTED] with the message: GET IBM-MAIN INFO Search the archives at http://bama.ua.edu/archives/ibm-main.html
