24/09/16, 18:55, Collin Anderson kirjoitti: > I do lots of DC/DC stuff with power dissipation one of my primary concerns - > so I stitch and I stitch A LOT.
Some of the following may be redundant so feel free to skip... ;) Regarding components that need thermal vias it's best to define them in the library model. This way there are no hacks needed like multiple segment GND-pads, etc. The copper pad, the thermal vias and the paste prints neatly separated and defined. That way it's easy to segment paste so that it doesn't go on/in the vias and the paste openings can have rounded corners etc. optimizations. No need for expensive plugged vias or problems with solder oozing to the other side. This has been production tested on QFN-52 and TO-263. The via stitching should be a part of zone filling definitions, so that edges could be automatically traced and the center filled with a pattern (with different parameters). Just a via fill mode should be provided too to make islands of vias within a zone. -Vesa _______________________________________________ Mailing list: https://launchpad.net/~kicad-developers Post to : [email protected] Unsubscribe : https://launchpad.net/~kicad-developers More help : https://help.launchpad.net/ListHelp
