Indrek Rebane,

I am struggling with 0.8mm BGA too. What you replied to Dennis is useful to me too. Could you give me further advice?
1)How many layers will you recommend for my 0.8mm BGA whith 256 pins in 20x20 array ( no pins in the central 12x12).
2)The ball size given by the chip manual is 0.5mm. I want to let the land size be 0.4mm to left more space to place vias and tracks among the pins. In your experience, will there be any problem in installing BGA chip?


Xiangchen

----- Original Message ----- From: "Indrek Rebane" <[EMAIL PROTECTED]>
To: "Protel EDA Discussion List" <[EMAIL PROTECTED]>
Sent: Wednesday, October 27, 2004 2:54 AM
Subject: Re: [PEDA] .5mm Pitch BGA's



Hi Dennis,

Dennis Saputelli wrote:
for your .8mm BGA what trace line width and air gap do you use?

~0.1mm trace for signals, 0.2mm trace for power pins. Most of the signal lines get impedance matched. Depends on design requirements and stack-up. Minimum clearance is usually 0.1mm, again depends on design.

what ball pad size?

Have different components, from 0.3mm (+/- 0.05mm) to 0.5mm (+/- 0.05mm) ball sizes. Pad is derived from there, according to upcoming IPC-7351 standard.

what via dia and via hole ?

0.25mm hole and 0.45mm capture pad in dense places, larger holes/pads everywhere else.

Indrek

--
 Indrek Rebane           |      Borthwick-Pignon
 Electronics Engineer    |    Tartu Science Park
 Phone: (+372) 7 302 641 | Riia 185, 51014 Tartu
 Fax:   (+372) 7 383 041 |               Estonia
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