Can anyone direct me to some research papers published about the advantages
and disadvantages of using Gold emersion on mulitlayer pcbs. I have only
heard information from pcb vendors but would like to see something
published. Any documentation that includes manufacturing results would be
great.
Thanks in advance.

Lloyd Good
Engineering Systems Co-ordinator
GE Harris Energy Control Systems Canada Inc.
2728 Hopewell Place NE
Calgary, AB, Canada T1Y 7J7
* +1 (403) 214-4777
* +1 (403) 287-7946


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