Brad & Mark

X&Y CTE are Coefficient of Thermal Expansion, X and Y directions.

-Frank



At 02:03 PM 7/9/2001 -0500, you wrote:
>Hi Brad,
>         Your right about the tables they are mislabeled. They were 
> correct in the 9-26-99 document put out by The Copper Connection Inc.
>
>DS= dimensional Stability
>CHEM= Chemical resistance
>+ = better
>- = worse
>%RC = % of resin content
>as for X&Y CTE you got me
>Cheers
>Mark
>At 09:21 AM 7/9/01 -0700, you wrote:
>>Mark,
>>         I read your comments and went to my IPC-2222. I am no IPC expert by
>>any stretch but aren't the tables you specify (4-2 ... 4-6) only for copper
>>clad laminates, where are the prepregs? Or is this a typical IPC f***up and
>>they have mislabeled their tables to imply something which was not intended,
>>I hate their documents because of these types of incongruities.
>>         Can anybody answer these questions in regards to these tables?
>>
>>What is DS?
>>Where is the X & Y CTEs? Why are they not included?
>>What exactly is CHEM?
>>What do the +, - and blanks mean in the last three columns?
>>
>>Damn the IPC is so stupid when it comes to their documents, you need a guide
>>to their guides because they don't adequately support their information.
>>
>>         Oh, spotted one for Mike Reagan, see IPC-2222 section 4.3.2. There
>>is your requirement for specifying individual dielectric thickness within
>>the stack up or else the manufacturer can do anything down to 0.09mm
>>(3.5mil) minimal thickness. Note that in all legal documents the word
>>"Shall" is synonymous with "must", it is a requirement for the standard.
>>
>>Brad Velander,
>>Lead PCB Designer,
>>Norsat International Inc.,
>>#300 - 4401 Still Creek Dr.,
>>Burnaby, B.C., V5C 6G9.
>>Tel. (604) 292-9089 direct
>>Fax (604) 292-9010
>>website www.norsat.com
>>
>>
>> > -----Original Message-----
>> > From: Mark E Witherite [mailto:[EMAIL PROTECTED]]
>> > Sent: Monday, July 09, 2001 9:35 AM
>> > To: Protel EDA Forum
>> > Subject: Re: [PEDA] Layer Stackup Info.
>> >
>> >
>> > Hi Jeff,
>> >          The IPC-2222 is the one that has the prepreg and
>> > core info you
>> > want.  I have always let the board house decided how they are
>> > going to meet
>> > my specks of board thickness and layer separation.  Then have
>> > them send me
>> > the stack up configuration that they propose to use.  I then
>> > check their
>> > stack up with the tables (4.2 to 4.6) just to insure a good stack up.
>> > Cheers
>> > Mark
>> >
>
>Mark Witherite
>Assistant Research Engineer
>Astronomy & Astrophysics
>Penn State University
>2565 Park Center Blvd
>Suite 200
>State College, PA.  16801
>email [EMAIL PROTECTED]
>telephone 814 865 9839
>fax           814 865 9100
>IPC PWB  Certified
>

Frank Gilley
Dell-Star Technologies
(918) 838-1973 Phone
(918) 838-8814 Fax
[EMAIL PROTECTED]
http://www.dellstar.com

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