But the tradeoff is the cost of laser drilling vs. normal drilling. ----- Original Message ----- From: "Jon Elson" <[EMAIL PROTECTED]> To: "Protel EDA Forum" <[EMAIL PROTECTED]> Sent: Friday, December 07, 2001 3:03 PM Subject: Re: [PEDA] Blind and buried via's Mayhem
> Jeff Stout wrote: > > > [snip] > > > > > At 03:53 PM 11/29/2001 -0600, Jeff Stout wrote: > > > >1. Can I use a hole pair that goes through the prepreg, but > > > >does not go through the core material above or below that > > > >level? I just don't see how it can be manufactured. > > > > > > No. At least not to my knowledge. My understanding of the process is > > that > > > basically you can only use blind vias on cores. You may not connect cores > > > to one another except with full through-hole vias. > > The exception to this is with vendors who use laser drills (similar to > micro-via technology). The power and duration of the laser pulse > controls how deep the hole goes. So, there, they can drill blind vias > in a laminated board, but not buried, of course. Those still have to > be drilled in the cores before the lamination step. > > Jon > > * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * * To post a message: mailto:[EMAIL PROTECTED] * * To leave this list visit: * http://www.techservinc.com/protelusers/leave.html * * Contact the list manager: * mailto:[EMAIL PROTECTED] * * Forum Guidelines Rules: * http://www.techservinc.com/protelusers/forumrules.html * * Browse or Search previous postings: * http://www.mail-archive.com/[email protected] * * * * * * * * * * * * * * * * * * * * * * * * * * * * * *
