But the tradeoff is the cost of laser drilling vs. normal drilling.
----- Original Message -----
From: "Jon Elson" <[EMAIL PROTECTED]>
To: "Protel EDA Forum" <[EMAIL PROTECTED]>
Sent: Friday, December 07, 2001 3:03 PM
Subject: Re: [PEDA] Blind and buried via's Mayhem


> Jeff Stout wrote:
>
> > [snip]
> >
> > > At 03:53 PM 11/29/2001 -0600, Jeff Stout wrote:
> > > >1. Can I use a hole pair that goes through the prepreg, but
> > > >does not go through the core material above or below that
> > > >level?  I just don't see how it can be manufactured.
> > >
> > > No.  At least not to my knowledge.  My understanding of the process is
> > that
> > > basically you can only use blind vias on cores.  You may not connect
cores
> > > to one another except with full through-hole vias.
>
> The exception to this is with vendors who use laser drills (similar to
> micro-via technology).  The power and duration of the laser pulse
> controls how deep the hole goes.  So, there, they can drill blind vias
> in a laminated board, but not buried, of course.  Those still have to
> be drilled in the cores before the lamination step.
>
> Jon
>
>

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